Purpose
  • Check:
    • Molding
    • Adhesive/Thermal paste placement
    • Manufacturing quality
    • Component placement
  • Detect:
    • Dead pixels of screens
    • Damaged connector pins
  • Label/Painting control
Special features
  • Contactless method
  • Quick changeover time (<1 sec)
  • Easy to adapt between product variants
  • Sub millimeter accuracy
DUTs
  • PCBAs
  • Semi assambled products
  • End-products
Instruments
  • Cameras:
    • Cognex 2D
    • Keyence 2D
  • Line 3D scanners
    • Micro epsilon 3D
    • Keysight X16
  •  Illuminations
    • Ring
    • Coaxial
  • Lenses
    • Telecentric
Size
  • 1000x1500x2000mm (WxDxH) 800kg
Feed
  • Operator (manual)
  • Robot
  • Inline (Input Conveyor, Passed Conveyor, Failed Conveyor)
Interfaces
  • Between Tester and Factory:
    • Ethernet (MES)
    • Power Grid
    • Safety Signals
  • UI
    • Easy to use interface
    • For operation
    • For maintanace
Others:

CE compilant

Price: 

from 80 000 EUR

AOI, 3D Optical Inspection System

Back